Electroplating Anodes

As a leader in providing advanced sputtering targets, Nikko Metals understands the strict requirements

Electroplating Anodes

As a leader in providing advanced sputtering targets, Nikko Metals understands the strict requirements of semiconductor metallization and back- end packaging applications. OPTIPLATE? anodes were developed with these industry expectations in mind. They are manufactured using the same processes developed for sputtering targets toensure consistency and performance. With Nikko Metals' OPTIPLATE? anodes you can be assured of consistent, quality performance for your electroplating needs - from interconnect toback- end packaging. Available in a variety of size, and configurations, including specialty material compositions and microstructures. Copper

Copper Phosphorous

OPTIPLATE? Anodes feature:

Void Free Microstructures

Uniform Dissolution

Uniform Alloy Distribution

Consistency and Quality Suitable for the Semiconductor Industry

R & D and Engineering Support

Certificate of Analysis Provided with Each Anode

Cleaned and Packaged toSemiconductor Standards

Supported by Nikko Metals Worldwide Infrastructure