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Sputtering Target Bonding

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note_add 20/01/2009
update 20/01/2009
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Offer Description - Sputtering Target Bonding



Rate for Location precision : Within 0. 5 mm

1) Bonding rate : over 97% 2) Bending : 0. 2~ 2. 0 mm 3) Rate for Location precision : Within 0. 5 mm Coating material used for the film coating metallic or ceramic film used in manufacturing industry such as flat monitor including LCD, electronic parts like semi- conductor with Sputtering method. These materials are perfectly bonded to backing plate made in copper and applied for Sputtering process ISO 9001 Inquiry reco mm ended Inquiry reco mm ended
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